JPS6289158U - - Google Patents
Info
- Publication number
- JPS6289158U JPS6289158U JP18205385U JP18205385U JPS6289158U JP S6289158 U JPS6289158 U JP S6289158U JP 18205385 U JP18205385 U JP 18205385U JP 18205385 U JP18205385 U JP 18205385U JP S6289158 U JPS6289158 U JP S6289158U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- bonding pad
- aluminum wiring
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18205385U JPS6289158U (en]) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18205385U JPS6289158U (en]) | 1985-11-25 | 1985-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289158U true JPS6289158U (en]) | 1987-06-08 |
Family
ID=31127497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18205385U Pending JPS6289158U (en]) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289158U (en]) |
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1985
- 1985-11-25 JP JP18205385U patent/JPS6289158U/ja active Pending